Sputtering deposition equipment - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

R&D cluster PVD equipment (ferromagnetic materials, alloys, dielectric film deposition)

Multilayer film formation of sputtered films and evaporated films.

In the development of new materials for ferromagnetic and ferroelectric materials, controlling composition and crystal orientation is extremely important. This device provides a highly useful film deposition environment for exploring the physical properties of these functional materials by adopting a confocal sputtering method with up to four cathodes (sputter up/down). Additionally, it is equipped with an automatic load lock and transfer chamber, and is compatible with an electron beam evaporation source (6 kW with four crucibles), allowing for efficient co-sputtering and multi-material film deposition through PC-controlled automatic/semi-automatic operation. In particular, when depositing ferromagnetic materials, the low target utilization efficiency of ferromagnetic targets (Fe, Co, especially high-purity pure iron 3N5–4N) is known to hinder the efficiency of research and development. This device addresses this issue by employing a cathode with a very high magnetic field at the target surface, thereby improving the film deposition efficiency of ferromagnetic materials, including pure iron targets. As a result, it demonstrates high performance and flexibility as a thin film deposition device for R&D, from material exploration to prototype research.